Product Main

Specifications

PopwinTech provide several kinds of high density PCBA especially in electronic products, PCBA semi-finished products and other PCBAs. The PCBA workshop of PopwinTech's SMT pick and place chips more than 6 million point a day; AI DIP more than 2 million pieces a day; Four lines of manual placement; Five lines of testing; Three lines of assembly. thomas(at)popwintech.com These production lines can meet the machining and assembly of various kinds of home appliance, communication products, PC products.

Technology Ability:
Our Pick and Place machine can assemble fine pitch chips such as 0201 size chip; Multi-functional machine can match 0.3 pitch packages such as QFP, BGA, uBGA, CSP and so on; DIP can match the assembly of standing and lying parts and jumper. To cater for the internationalization tendency, lead-free reflow solder machine and wave solder machine have been introduced to our company in 2000, meanwhile, we have put efforts on the research to the lead-free solder tin and reflow curve and wave flow. Now we have abundant practical experience on manufacture electronic products.