Technical specifications
 

Measurable elements: K to U
Range of element content: 1ppm-99.99%
Measurable thinnest plating is 0.05um
Arbitrary optional analysis and identification models
Independent matrix effect correction models
Multi-variable non-linear regression procedure
Repeatability: 0.1％
Stability: 0.1％

Standard configurations

Packaging case, integrated design with the instrument
Four groups of changeable filters
Laser positioning system
Sealed sample chamber with lead shielding cover
Si-PIN detector
Signal Detection Electronic Circuit
Integrated mini end window X-ray tube
Wireless Bluetooth connection with PDA
Large-capacity Lithium battery with charging circuit and AC to DC adapter

 

Application fields
 

Hydrological survey
Plating Thickness Measurement
Plating solution analysis
Geographic prospecting
Archeological study