vision repair motherboard machine ZM-R5860C BGA rework station, soldering bga machine
Feature:
1, repair kinds of motherobard, bga chip
2,repair laptop, xbox360 and mobile bga chip
3, top and bottom hot air heater and 3rd infrared heater
4, touch screen operation, easy to operate, shows current temperature curves, set and analyze temperature parameters.
5, repair lead or lead free chip
6, CE approved
7, Camera vision system can clearly observe solder ball melting process.
Specification
Feature:
1, repair kinds of motherobard, bga chip
2,repair laptop, xbox360 and mobile bga chip
3, top and bottom hot air heater and 3rd infrared heater
4, touch screen operation, easy to operate, shows current temperature curves, set and analyze temperature parameters.
5, repair lead or lead free chip
6, CE approved
7, Camera vision system can clearly observe solder ball melting process.
Specification
|
1
|
Total Power
|
4850W
|
|
2
|
Top heater
|
800W
|
|
3
|
Bottom heater
|
2nd heater 1200W,3rd IR heater 2700W
|
|
4
|
power
|
AC220V±10% 50/60Hz
|
|
5
|
Dimensions
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L635*W600*H560 mm
|
|
6
|
Positioning
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V-groove, PCB support can be adjusted in any direction and with external universal fixture
|
|
7
|
Temperature control
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K-type thermocouple (Closed Loop), heating independently, temperature precision within ±3 degree
|
|
8
|
PCB size
|
Max 410*370mm Min 20*20mm
|
|
9
|
Electrical materials
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Taiwan touch screen + Delta PLC + high precision intelligent temperature control module
|
|
10
|
Net weight
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40KG
|
|
11
|
Package
|
Wooden Box
|
|
12
|
G.W.
|
78KG
|
|
13
|
Package dimension
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L78*W78*H77cm.
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