Product Main

Specifications

  • Technical requirement:
    • Surface-mounting technology (SMT) and through-hole/DIP
    • 0201, 0402, 0603 size components SMT technology and lead free technology
    • ICT (in circuit test), FCT (functional circuit test) technology
    • UL, CE, FCC, RoHS marks
    • With IPC-610D manufacturing and other international standards
    • Nitrogen gas re-flow soldering technology for SMT
    • High density interconnected board placement technology capacity
  • Others requirement:
    • Capable of developing effective production process to ensure high quality, ensure product quality and reliability
    • Meets the international environmental protection requirement
    • Complicated boards and components are available
    • Provides OEM services to all sorts of printed circuit board assemblies
    • PCBA, PCB assembly, SMT assembly
    • One-stop OEM services provider PCB assembly and function test
    • Experienced components sourcing team
    • Type of productions: SMT, DIP process ICT test Professional engineering staff to provide technical support OEM services are welcomed PCB assembly, PCBA, SMT, DIP assembly profound knowledge of contract manufacturing services capable of developing effective production process to ensure high quality