· Vendor to be UL recognized to minimum category of 94V0

· Fabricated in accordance with IPC_A_600, latest version unless otherwise specified in attached specification.

· All patterns according to Customer PCB Artwork/Film/Gerber File.

· Material: FR_4 other

· We would provide a copy of UL materials certificate.

· Weight of Copper: 1 oz per sq . Ft(Base Material)for Outer Layers. Finish to be 2oz per sq. Ft oz per sq. Ft(Base Material)for Inner Layers.

· Finished Board thickness shall be(Tolerance is ± 10%): 0.8mm 1.0mm 1.2mm 1.6mm Other

· Finishing according to IPC_TM_650(2.2.13)latest version.

· Via Method: PTH NPTH Blind Via between layer

· PCB must be identified with MFR’ S approval logo, type designation week and year(WWYY) OF MFR and Customer P

· MFR’ s UL Logo& indicated location According to PCB Drawing of Gerber data

· Date code location: Print on Top/Bottom Side Silkscreen Layer

· Etch on Top/Bottom Side Copper Layer.

· Customer Part No. & Silkscreen Layers According to PCB Drawing or Gerber data indicated location.

· All PCB will be electrical tested before shipment

· Other Test and Reliability standard refer to IPC_A_600(latest version)PCB Class1 Class2 Class 3

· As per ion_contamination test results. (IPC_TM_650 Test Method2.3.25)

· Finishing: HAL ENTEK Pre_flux Gold Flash Gold Plating Immersion Tin Immersion Silver Immersion gold

· Min. Hole size: 12mil or mm(Remark: The minimum hole size are for drill bit size)

· Legend Silkscreen: Top or Bottom side

· Legend marking do not allow printed on soldering pad and must keep clearance 10 mil min, leave to the soldering pad

· Silkscreen color: White Yellow Black

· We will provide specification & Materail Safety Data Sheet(MSDS) of legend ink

· Soldermask: Wet film Dry film Conventional Peelable

· Plug all via holes by soldermask on Top Side or Bottom Side

· Soldermask color: Green Blue Yellow Red Other

· Fabrication: Routing Punching Handmade

· All sample board and risk buy order will be acceptable for routing

· PCB Unit/Panel size: 163.3X215.6inch/mm

· Comply RoHS standard

· Packing: handwork package
Inner packing: vacuum package
Outer packing: carton

· Pattern Comparison :All patterns according to PCB Artwork/Film/Gerber File.

· Trace & Space Width Within ± 20% per artwork.

· Conductor Nicks, scratches or pinholes < 20% of nominal width

· E_test Mark Must be present after Electrical Test.

· Hole Sizes :Guide Holes _Measuring all, all according to Fab Dwg.
PTH _Sampling at least 10 of evenly distributed holes of each hole size, all
according to Gerber file or hole charts. NPTH _For punch holes, the tolerance ± 0.1mm. For drill holes, the tolerance ± 0.05mm.

· Outline Dimensions: All dimensions according to Fab Dwg

· Guide Holes Locations: All guide holes locations according to Fab Dwg

· V_Cut: Distance of 2 V_Cut tips along H_plane of PCB < = 0.1mm Distance of 2 V_Cut tips along V_plane of PCB < = 1/3 T,

where T = thickness of PCB, unless otherwise specified by Fab Drawing

· Bow and Twist: Placing both sides in a flat surface, the highest point of both sides to the diagonal length < 1% for non_SMT and < 0.75% for SMT PCBs.

· Conductor Thickness Evaluation (Micro section or Radioactive Equipment): PTH wall and trace Cu finishing thickness > 0.025mm Pb/Sn thickness > 0.002mm (HAL) Au thickness > 0.076µ m (Au PCB) > 0.76µ m (Au finger) Ni thickness > 1.3µ m (Au PCB) > 3.8µ m (Au finger)

· Solvent Resistance: IPC_TM_650 (2.3.23) No attack

· Solder ability: ANSI/J_STD_003 100% for Non_SMT, 95% for SMT

· Thermal Stress: IPC_TM_650 (2.6.8) No crack and delamination