• Layer count: four
• Base material: FR4 (Tg150)
• Copper thickness: 1oz
• Minimum hole size: 0.3mm
• Minimum line width/space: 0.35mm
• Solder mask: glossy green/10 to 30um
• Blind buried holes: supported
• Controlled impedance: supported
• Surface treatment: immersion gold
• Finished board thickness: 1.6mm
• Panel array: five pieces in one panel
• Profile: CNC routing and v-cut