Production Capability
|
No.
|
ITEM
|
INDEX
|
|
1
|
Surface Treatment
|
LF HASL, OSP, Immersion Gold, Immersion Silver
|
|
2
|
Layer
|
Single Side,Double-Sided,Multilayer And Special Structure Layer
|
|
3
|
Max Size
|
1200mm*600mm
|
|
4
|
PCB Thickness
|
0.5mm~5.0mm
|
|
5
|
Copper Foil Thickness
|
H,1,2,3,4,5,6~10oz
|
|
6
|
Dielectric Layer Thickness
|
50,75,100,125,150micron
|
|
7
|
Metal Base Type
|
Aluminum(1100,5052,6062)
|
|
8
|
Metal Base Thickness
|
0.5,0.8,1.0,1.2,1.5,2.0,3.2(mm)
|
|
9
|
Shaping
|
Die Punching,CNC Route,V-CUT
|
|
10
|
Testing
|
100%Computer Short/Open Test
|
|
11
|
The Minimum Hole Diameter
|
Single Side 0.8mm,PTH 0.3mm
|
|
12
|
The Minimum Pad Size
|
1.2mm
|
|
13
|
The Minimum PTH Distance
|
2.0mm
|
|
14
|
The Minimum Line Width
|
0.1mm
|
|
15
|
The Minimum Increase Of Solder Mask
|
0.15mm
|
|
16
|
The Minimum Pad
|
10 micron
|
|
17
|
Solder Mask Color
|
Green, White, Black,Red,Yellow
|
|
18
|
The Minimum Letter Width
|
0.15mm
|
|
19
|
The Minimum Letter Height
|
0.8mm
|
|
20
|
Letter Color
|
White, Black,Blue,Yellow,Red
|