Product Main

Specifications

  • Layer count: 4
  • Base material: FR4 (Tg170)
  • Copper thickness: 1oz
  • Minimum hole size: 0.35mm
  • Minimum width/space: 0.4mm
  • Finished board thickness: 1.6mm
  • Solder mask: glossy green/10 to 30um
  • Surface treatment: immersion silver
  • Profile: CNC routing and v-cut
  • Panel array: 8 pieces in one panel