• Layer count: 8
• Base material: FR4
• Copper thickness: 1oz
• Minimum hole size: 0.25mm
• Minimum line width/space: 3mil/3mil
• Solder mask: blue/10 to 30um
• Surface treatment: immersion gold
• Finished board thickness: 1.6mm
• Panel array: four pieces in one panel
• Copper thickness on PTH: 12.7um (minimum), 15um (average)
• Application: Telecom