• Layer count: 6
• Base material: FR4
• Copper thickness: 1oz
• Minimum hole size: 0.2mm
• Minimum line width/space: 3mil/3mil
• Solder mask: blue/10 to 30um
• Surface treatment: immersion
• Finished board thickness: 1.0mm
• Panel array: eight pieces in one panel
• Panel size: 544 x 620mm
• Precision of profile size: 0.1mm