• Specifications:
  • Layer count: four
  • Base material: FR4 (Tg170)
  • Surface treatment: ENIG
  • Minimum hole size: 0.3mm
  • Minimum line width/space: 0.2mm/0.2mm
  • Copper thickness: 1oz
  • Finished board thickness: 1.6mm
  • Plating thickness PTH and over: 0.79-mil/1.38-mil
  • Solder mask color: matt green
  • Profile: Stamp holes and CNC routing
• Applications:
  • Suitable for consumptive electronics