• Layer count: 6 layers
• Base material: FR4 (Tg170)
• Copper thickness: 1oz
• Hole size: 0.4mm (minimum0
• Line width/space: 5mil/5mil (minimum)
• Finished board thickness: 1.6mm
• Laminate thickness: 15-mil
• Plating thickness PTH and over: 0.79-/1.38-mil
• Solder mask: glossy green/10-30um
• Nickel thickness: 0.16-mil
• Panel array: four pieces in one panel
• Suitable for mobile phones