• Material: FR4
• Layer: 6
• Finished base copper thickness: 1oz
• Finished board thickness: 1.6mm
• Min hole size: 0.3mm
• PTH hole copper thickness: 10 to 50um
• Outer layer line width/space (minimum): 75um/75um
• Surface treating process of inner layer: brown oxide
• Solder mask thickness: 10 to 30um
• Surface treatment: immersion NI/Au
• Profile: routing and v-cut
• Can be used for mobile phone motherboard