• Layer: 6
• Base material: FR4
• Copper foil: 1oz
• Finished board thickness: 1.2mm
• Minimum hole size: 0.2mm
• Minimum line width: 0.1mm
• Minimum line space: 0.1mm
• Inner layer: brown oxide
• Solder mask: green/10 to 30um
• Surface treatment: immersion gold
• Application: digital products