• Layer count: 6
• Base material: FR4 (Tg170)
• Copper thickness: 1oz
• Finished board thickness: 0.8 ±0.1mm
• Min line width/space: 3/3 mil
• Min hole diameter: 0.2mm
• Surface treatment: Immersion gold
• Solder mask: Matt green/10-30um
• Panel array: Five pieces in one panel
• Application: Bluetooth earphones