Product Main

Specifications

  • Layer count: four
  • Base material: FR4 (Tg150)
  • Copper thickness: 1oz
  • Hole size: 0.35mm (minimum)
  • Line width/space: 0.4/0.4mm (minimum)
  • Surface treatment: ENIG
  • Solder mask: Glossy green/10-30um
  • Finished board thickness: 1.2mm
  • Profile: CNC routing and v-cut
  • Application: consumer electronic products