PARAMETER		UNIT	1#	2#	3#	7#	9#	11#
GRADE			Polished Silicon wafer(prime)	Polished Silicon wafer(prime)	DSP Prime	DSP(test)	DSP(prime)	DSP(prime)
DIAMETER		mm	100+/-0.3	100.0±0.20	100+/-0.3	100+/-0.3	100+/-0.5	150.0±0.50
TYPE			P	N	N-Type	P	P	N
DOPANT			BORON/	P/	Phos.	BORON/	BORON/	Phosphorus/
XTAL  ORIENTATION		DEGREE	1-0-0	1-0-0	<100>	1-0-0	1-0-0	1-0-0
THICKNESS		MICRON	525.0±20	525.0±20	525+/-25	525.0±20	970+/-20	675.0±25.0
RESISTIVITY          CTR		Ω.CM	1-10	1-10	1-30	1-30	1-30	1-10
RRG  1        C-1/2R      MAX		%	/	/	/	/	/	/
RRG  2       C-6mm      MAX		%	10		/	10	8	≦10
SLICE  ORIENTATION		DEGREE	0±0.5°	0±0.5°	/	0±0.5°	1-0-0+/-0.5	0°±1.0°
OXYGEN                CTR.		NEW PPMA	12.5-16.5	8.0-18.0	/	12.5-16.5	13-19	11.5-18.5
ORG                           MAX		%	5	/	/	5	/	≦10
PRIMARY  FLAT LOCATION			<110>±1.0°	<110>±1.0°	<100>1-1-0	<110>±1.0°	(110)+/-0.5	｛110｝±1.0°
PRIMARY  FLAT LENGTH		MM	32.5±2.50	32.5±2.50	32.5±2.50	32.5±2.50	32.5+/-2.5	57.5±2.5
SECONDARY  FLAT LOCATION			clockwise 90°±5°		None	clockwise 90°±5°	N/A	None
SECONDARY  FLAT LENGTH		MM	18±2	None	/	18±2	/	None
CARBON              CTR.		NEW PPMA	≦1.0	≦1.0	/	≦1.0	1.0	≦0.5
TTV		MICRON	≦10.0	≦10.0	/	≦10.0	</=15	≦10.0
BOW		MICRON	≦40	≦30.0	/	≦40	</=40	≦60.0   3p ref
WARP		MICRON	≦40	≦30.0	30	≦40	</=40	≦60.0   3p ref
EDGE  CONTOUR			round22°	5, 0, 23, 6, 5, 0, 24, 18	/	round22°	SEMI STD	SEMI-M1(R-TYPE 22.0°)
FS  PARTICLE	LIGHT			/	/		/	/
	SIZE	MICRON	≧020	≧0.30	/	≧020	>/=0.5	Max.< 30 ( > 0.2μm)
	#/SL		<20.0	<10.0	/	<20.0	</=10	Norninal Edge Excusion </=3mm
OISF		#/SQ  CM	≤100	≤100	/	≤100	</=100	< 100
SILICE BACK		TYPE		BSP	Polishing		Etched	ACID ETCHED
GLOBAL TIR		MICRON	≦5.0	≦5.0	≦5.0	≦5.0	≦5.0	≦5.0
PACKAGE		standard packing	standard packing	5, 0, 30, 9, 5, 0, 31, 18	standard packing	standard packing	standard packing	standard packing
REMARKS		upack A   25pcs/box
we can also customize according to your needs,  if you have any enquiry, please feel free to inform us.