Description
1.Layer:1-12 layer
2.Material:FR-4
3.Board thickness:0.2-3.5mm
4.Min. drilled size:0.5mm
5.Min. line width:3mils
6.Min. line spacing: 3mils
7:Suface finish:HASL/HASL free
8.Copper thickness: 0.5oz-6oz
9.Solder mask color: green/black/white/red/blue/yellow
10.Packing: with bubble bag
1.Layer:1-12 layer
2.Material:FR-4
3.Board thickness:0.2-3.5mm
4.Min. drilled size:0.5mm
5.Min. line width:3mils
6.Min. line spacing: 3mils
7:Suface finish:HASL/HASL free
8.Copper thickness: 0.5oz-6oz
9.Solder mask color: green/black/white/red/blue/yellow
10.Packing: with bubble bag
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.