Specifications:
Sheet metal stamping and punching
Painting lines
Die casting lines
Powder coating lines
Silkscreen and pad printing
High-speed SMT and DIP assembly
Provide cost effective and high-quality vertical manufacturing services PCB assembly to final case assembly:
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Sheet metal stamping and punching
Painting lines
Die casting lines
Powder coating lines
Silkscreen and pad printing
High-speed SMT and DIP assembly
Provide cost effective and high-quality vertical manufacturing services PCB assembly to final case assembly:
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole

