Meterial: FR4

Thickness: 1.6mm

Surface finishing :HASL
Green soldermask
Total components:238

Offer:SMT DIP COB BGA Assembly

Test:E-testing,functional test,AOI and re-BGA

 

Our PCB Assembly capacity:

Surface Mount Technology

Single/Double Sided SMT

Minimum chip size component: 0201
Standard chip size component: 0603 and larger
ICs - SOICs, SSOPs, QFPs

Fine Pitch ICs : pitch less than 0.021

BGAs, uBGA

Convection & IR Reflow Solder

Through Hole (TH)

Manual Insertion

Automated Pin Insertion

Manual Soldering

Wave&re-flow  Soldering

 

Test:functional, ICT, Flying Probe, test programming,
      cable scan,AOI x-ray inspection,BGA rework device

No MOQ

We will reply you within 5hours,and quote to you within 3 working days.