Tin (Sn)
1, Physical character:
Atomic Weight: 118.71
Electronegative: 1.96
Density: (beta)7.365 g'cm-3
Density: (alpha)5.769 g'cm-3
Melting Point: 231.93 'c
Boiling Point: 2602 'c2, Specification:
Atomic Weight: 118.71
Electronegative: 1.96
Density: (beta)7.365 g'cm-3
Density: (alpha)5.769 g'cm-3
Melting Point: 231.93 'c
Boiling Point: 2602 'c2, Specification:
2.High Purity Tin:
Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of AG, Al, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Pb & Zn is bellow 10 ppm;
Uitra Purity Tin:
Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of AG, Al, Au, Ca, Co, Cu, Fe, Mg, Ni & Zn is bellow 1 ppm.
Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of AG, Al, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Pb & Zn is bellow 10 ppm;
Uitra Purity Tin:
Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of AG, Al, Au, Ca, Co, Cu, Fe, Mg, Ni & Zn is bellow 1 ppm.
3, Physical Size:
Virgulate, Ingot, Powder.
Virgulate, Ingot, Powder.
4, Usage:
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
5, Packing:
It is packed with dacron film, then covered with a sealed plastic film bag.
It is packed with dacron film, then covered with a sealed plastic film bag.