Designed to comply with IATA RP1740c
High-speed programming for seamless
High-speed programming for seamless
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Chip Type
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ISO/IEC 18000-6C EPC Class 1 Gen 2
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EPC Size
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96-480 Bits
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User Memory
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512
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Programming Cycles
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10,000 Write Cycles
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RF Specifications
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Operating Frequency
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840-960 MHz
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Operating Mode
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Passive
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Mechanical
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Face Material
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Thermal Printing Synthetic Paper
Thermal Transfer Synthetic Paper
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Dimension
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2 x 17 in 2 x 19 in 2 x 21 in
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Caliper
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80 µm
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Backing Material
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62 g/m² GLASSINE
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Adhesive Strength
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Tack min
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14.0 N / in FTM 9
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Shear min
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2.0 h FTM 8
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PE-loopback min
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10.0 N / in modified FTM 9
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Environmental Specifications
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Storage Conditions
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-25°C to +50°C
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Operating Conditions
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-20°C to +70°C
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Labeling
temperature min
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0°C
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