|
1 |
Layer |
1-12 layer |
|
2 |
Material |
FR4,CEM-1,CEM-3,Hight TG |
|
3 |
Board thickness |
0.6mm-2mm |
|
4 |
Max.finished board side |
650mm*550mm |
|
5 |
Min.drilled hole size |
0.25mm |
|
6 |
Min.line width |
0.075mm(3mil) |
|
7 |
Min.line spacing |
0.075mm(3mil) |
|
8 |
Surface finish/treatment |
Chemical tin,Chemical gold,Immersion gold,Osp,Gold plating |
|
9 |
Copper thickness |
1-4.0oz |
|
10 |
Solder mask color |
green,black,white,red,blue,yellow |
|
11 |
Inner packing |
Vacuum packing,Plastic bag |
|
12 |
Outer packing |
Standard carton paking |
|
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
|
14 |
Certificate |
ISO 9001:2000 ISO 14001:2004 ISO/TS 16949 |
|
15 |
Profiling punching |
Routing,V-Cut,Beveling |
|
16 |
Providing OEM service to |
all sorts of printed circuit board assembly |
