|
Item
|
Parameter
|
|
|
Number of layers
|
1-2.
|
|
|
Base Material Thk.
|
D.S.
|
0.6-4.0 mm
|
|
MLB
|
0.6-4.0 mm
|
|
|
Max. Board Size
|
D.S.
|
500*1000 mm
|
|
MLB
|
500*1000 mm
|
|
|
Monthly Capacity
|
Rigid PCB
|
10,000㎡(DS&Multi-Layer)
|
|
Hole Dia. Tolerance
|
NPTH
|
±0.05mm
|
|
PTH
|
±0.076mm
|
|
|
Copper
|
0.5-4.0 OZ
|
|
|
Min. Hole Diameter
|
0.5mm
|
|
|
Min. Hole to Hole Tol.
|
±1mil
|
|
|
Min. L/Width L/spacing
|
4 mil
|
|
|
Solder Mask Hardness
|
≥6H
|
|
|
Surface Finish Immersion
|
Immersion gold/HAL/OSP
|
|