Product Main

Specifications

  • Power PCB
  • Layers count: 8 layers
  • Thickness: 2.0mm
  • Copper: 6oz
  • Finish: immersion silver

No. of Layers
1-40
Base Material Thk.
D.S.
0.2-3.2mm
MLB
0.4-3.2mm
Max. Board Size
D.S.
700*800mm
MLB
600*800mm
Monthly Capacity 
Rigid PCB
10,000㎡(DS&Multi-Layer)
Hole Dia. Tolerance
NPTH
±0.05mm
PTH
±0.076mm
Copper
0.5 oz-7 oz
Min. Hole Diameter
0.1mm
Min. Hole to Hole Tol.
±1mil
Min. L Width L spacing
4 mil
Solder Mask Hardness
≥6H
Surface Finish
Immersion gold/Immersion Silver/Immersion tin/Lead-free HASL/Gold plating/OSP