APPLICATIONS
This inexpensive bench-top removes or installs through-hole components on SMT boards without damage to adjacent devices. It will process ICs, including DIPs, QFPs, PGAs, connectors and odd forms without reliance on slow, labor-intensive manual methods. The Mini Wave is ideal for short-runs requiring precision and repeatability. Simple to use, the operator first sets the soldering temperature desired from 0° to 400°C covering any tin/lead or lead-free thermal requirement. The correct nozzle is then selected from the 3 that are included, with many additional custom nozzles also available. The wave is activated by an on/off switch while Z-motion wave immersion and dwell time is governed by foot switch. Component removal occurs when solder bonds are fluidized, allowing the operator to extract the component from the PCB. A replacement device can then be placed on the PCB. After prefluxing, the nozzle is positioned allowing soldering to take place.
1. Removes and installs most through-hole devices on PCBs, without damage to adjacent surface mount components.
2. A compact, easy-to-use, low-cost machine with fast payback realized from labor savings alone.
4. Wave is directly controlled by manual switch; solder bath dwell time controlled by foot pedal.
5. Includes customer's choice of 3 component nozzles from a total of 24 sizes available (see "Nozzles").
1. Power supply : 220V AC/60Hz 1.2Kw
NOZZLES SPECIFICATIONS
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Nozzle #
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Dimensions
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Nozzle #
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Dimensions
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1
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20mm x 40mm
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13
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50mm x 50mm
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2
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60mm x 60mm
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14
|
50mm x 80mm
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3
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15mm x 120mm
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15
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60mm x 80mm
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4
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15mm x 30mm
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16
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10mm x 60mm
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5
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20mm x 50mm
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17
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10mm x 80mm
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6
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20mm x 80mm
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18
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10mm x 100mm
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