Physical character:
Atomic Weight: 118.69 Melting Point: mp: 232 °C Boiling Point: bp: 2260 °C
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
Content below:
|
Purity(%)
|
As
|
Fe
|
Cu
|
Pb
|
Bi
|
Sb
|
Cd
|
Zn
|
Al
|
Total
|
|
99.99
|
0.0005
|
0.0025
|
0.0005
|
0.0035
|
0.0025
|
0.002
|
0.0003
|
0.0005
|
0.0005
|
0.01
|
|
99.95
|
0.003
|
0.004
|
0.004
|
0.01
|
0.006
|
0.014
|
0.0005
|
0.0008
|
0.0008
|
0.05
|
|
99.90
|
0.008
|
0.0025
|
0.008
|
0.04
|
0.015
|
0.02
|
0.0008
|
0.001
|
0.001
|
0.1
|