Material: FR1, FR2, CEM1, CEM3, FR4,
Board thickness: 0.4mm to 3.2mm
Base copper oz to 6oz
Min. hole size: 0.3mm
Min LW/LS: 0.1mm (Flash Gold)/0.15mm (HASL)
Aspect ratio: 1: 6
Solder mask: LPI type, baked type, Peel able mask
Surface finishing:HASL, Flash gold, Immersion gold, Gold finger, Carbon ink
Max. Panel size: 508mm x 610mm
Bow & twist: 0.7% (1.5mm board)
Hole size tol.:PTH: +/-0.08mm, NPTH: +/-0.05mm
Hole location tol: +/-0.05mm
Gold thickness: 0.05um to 1.5um
Nickel thickness: 1um to 5um