thermal pad:
 

     -High thermal conductivity
 

     -High conformability and cost effective
 

     -Naturally tacky requiring no additional adhesive coating
 

     -Electrically insulating
 

     -thermal conductivity: 0.8W/m.k~3.0W/m.k
 

     -thickness: 0.3mm~13mm

Features
Soft with high compressibility to reduce thermal resistance and enhance thermal conductivity Optional thermal conductivities for your cooling applications Naturally sticky Cost effective solutions with competitive price

Applications
- Between electronic components such as semiconductor, IC, CPU.MOS and heatsink.
- Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
- Cooling Module, Thermal Module, in all applications where a metal housing is used as heatsink