Hub blade is used for the semiconductor/packaga/LED/Electronic material/optics

High  technology for micro electroforming.
Precision apparatus to control diamond even coating with bonding.
 The super velocity centrifuge control grit size and clean all diamond powder.
Special electroforming technology to save backside-chipping problem.

The era of whole new CMP dresser is coming.
It is able to be dispersed the individual diamonds at the evenly spaced .we can control each diamond's each position as you want.