Specifications
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Plastic molding and injection
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Sheet metal stamping and punching and stamping dies
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Painting lines
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Die casting lines
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Powder coating lines
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Silkscreen and pad printing
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High-speed SMT and DIP assembly
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Chip-on-board (COB)
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Surface-mount technology (SMT)
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Ball-grid array (BGA)
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Materials: ABS, PP, POM, PVC, TPR, TPU, PA and glass fiber or any specific materials upon customers' request
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Product requirement like dual-injection, high temperature-endurance, high hardness and others are available upon request
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Flexible surface finish such as chrome plating, painting, water transfer printing, texture and more are available