SPECIFICATIONS
MATERIAL: (INSULATION) HEAT-SHRINKABLE POLYOLEFIN, (SOLDER) LEAD-FREE TIN, (RINGS) MELTABLE THERMALLY STABILIZED THERMOPLASTIC. 
SOLDER MELTING TEMP:  138℃, FLUX ACTIVATED ROSIN
WORK TEMP:  -55℃ to +125℃
SHRINKING TEMP:  >200℃ 
DIELECTRIC STRENGTH: 2kV
PROTECTION TYPE: IP 67

SPECIFICATIONS
MATERIAL: (INSULATION) HEAT-SHRINKABLE POLYOLEFIN, (SOLDER) LEAD-FREE TIN, (RINGS) MELTABLE THERMALLY STABILIZED THERMOPLASTIC. 
SOLDER MELTING TEMP:  138℃, FLUX ACTIVATED ROSIN
WORK TEMP:  -55℃ to +125℃
SHRINKING TEMP:  >200℃ 
DIELECTRIC STRENGTH: 2kV
PROTECTION TYPE: IP 67