2. Purity Level: 4N-7N
3. Analysis method: ICP-MS or GDMS
4. Size: as requested
5. Vacuum packing or Nitrogen protecting ,2Kgs /Bags
Tin ingot (Sn)
1, Physical character:
Atomic Weight: 118.71
Electronegative: 1.96
Density: 7.310 g·cm−3
Melting Point: 231.93 ℃
Boiling Point: 2602 ℃
2, Specification:
High Purity Tin:
Sn-05 Grade 99.999. The content of Tin is above 99.999%. The total content of Ag, Al, Au, Bi, Ca, Co, Cu, Fe, In, Mg, Ni, Pb & Zn is bellow 10 ppm;
Uitra Purity Tin:
Sn-06 Grade 99.9999. The content of Tin is above 99.9999%. The total content of Ag, Al, Au, Ca, Co, Cu, Fe, Mg, Ni & Zn is bellow 1 ppm.
3, Physical Size:
Rod, Ingot, Powder.
4, Application:
It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.
5, Packing:
Vacuum packaging