Product Main

Specifications

 
 
 
 
Product Name
 
 
 
 
 
 
 
OH ppm
 
 
 
Type comparison
 
 
 
Jointing and carriers
materials etc.
 
 
 
 
 
Dehydroxyl
Clear Fused
Quartz Rod
 
≤50
Baked,
GE214LD
PH300/308,
Ovisil451
High quality Jointing and carriers
materials etc.
 
 
≤50
Baked,
GE214LD
PH300/308,
Ovisil451
High quality Jointing and carriers
materials etc.
 
OD Range
OD
Wall Thickness
Siding
Ovality
Bowing/1220mm
 
<5mm
<±2.0%
<±8%
10%
1.5%
<2.5mm
 
5mm-13mm
<±1.5%
<±8%
8%
1.2%
<2.5mm
 
13mm-30mm
<±1.5%
<±7%
8%
1.0%
<3.0mm
 
30mm-80mm
<±1.5%
<±8%
8%
1.0%
<3.0mm
 

Typical Elements
Al
Fe
Ca
Mg
Li
K
Na
Ti
 
 
23.2
4.8
3.1
 2.5
2.0
5.4
6.1
 
 
Physical properties
Reference
Physical properties
Reference
 
Softening point
1680℃
coefficient of thermal expansion  (20-230℃)
5.7x10-7cm/cm.℃
 
Annealing point 
1210℃
thermal expansion (20℃)
1.4W/m.℃
 
strain point
1120℃
Heat (20℃)
670J/kg.℃
 
Density
2.2g/cm3
Resistivity  (350℃)
7x107ohm.cm
 
hardiness
5.5-6.5Mohs'
permittivity
3.75
 
strength of pulling resistance
4.8x107N/m2
Dielectric strength
5x107V/m
 
strength of pressure resistance
1.1x109N/m2