Contactless IC Module Picking-placing Machine YPP-4000

This machine is designed for precisely placing the single contactless IC chip onto chip fixing holes in the INLAY sheet. In order to ensure chip fixing precision, the IC chips are picked and placed with vacuum after air cylinder holds the PVC sheet to ensure its flatness.

Photoelectric sensor is applied to monitor and control the chip feeding. If failure or mistake occurs, it will give warning and stop the machine.

High-precise dual-axles are used to pick, move and place the chips with PLC controlled in order to ensure high position precision. 

Picking or placing location for each module can be individually adjusted to ensure high precision of positioning.  

It is designed to have two picking-placing units and two working tables to ensure high efficiency. 

The liquid glue injection unit is available in the latest design.

It is controlled by Mitsubishi PLC with big-size colorful man-machine interface display.  All the pneumatic parts are made by SMC.  

Different sheet layout (such as 3×8/4×8/5×5) can be proceeded on the same machine.

Technical Parameters

1.        Speed: 4000-4500 pcs per hour.

2.        Dimension: L1600×W700×H1900mm

3.        Weight: 650 KG      

4.        Power supply: AC220V 50/60HZ

5.        Power: 3KW

6.        Compressed air: 6 kg/cm2

7.        Air Consumption: 30 L/min.

8.        Control mode: PLC+ dual-axis location system

9.        Chip positioning precision: ±0.05mm