Minimum line space: 0.1mm/(width) 0.1mm
Minimum hole diameter: 0.2mm
Max board: 63 x 80.9mm
Thickness: 1.0mm
Base laminate materials: FR-4 and RCC
Board technology:f lash gold
Solder mask: Nanya (green)
Surface plating: Ni/Au
Principle products: printed circuit board, single sided, double sided, multilayer, chip on board PCB
Capacity:<UL>
Double: 100,000 SQ/year
4 layers: 100,000 SQ/year
Multilayer: 50,000 SQ/year</uL>
Base materials: FR4, CEM1, CEM3, 25FR/N, TLF-34 and 35
Soldermask: liquid photo imagerable, conventional, UL
Plating/surface finished: hot air leveling, flash gold, gold finger, electronics gold plating and plating tin