Layer: 1-12

Materials: FR-1, FR-2, FR-4, CEM-1, CEM-3, High TG and FR4 halogen-free

Board thickness: 0.2-3.5mm

Maximum panel size: 630x520mm

Minimum drilled hole size: 0.5mm

Minimum line width: 0.075mm (3mil)

Minimum line spacing: 0.075mm (3mil)

Surface finish/treatment: HASL/HASL lead-free, chemical tin/gold, immersion gold/silver/gold, Osp, gold plating

Copper thickness: 0.5 minimum, 5.0oz maximum

Solder mask color: green/black/white/red/blue/yellow

Inner packing: vacuum, plastic bag

Outer packing: standard carton

PTH: ±0.076

NTPH: ±0.05

Certificates: UL, ISO9001, ISO14001, ISO/TS16949 and RoHS

Profiling punching: routing, V-CUT and beveling