1, specilized in Bare board fabrication, full compenent procurement, SMT/BGA/DIP assembly
2,High precision 0201,0402,0603,fine pitch QFP,BGA, bonding size components
3,More competitive price,faster delivery,high quality
4,With IPC-A-600E standard.Base material: FR4,High TG FR4, Aluminium,Ceramic,CEM-1/22F,Special material
Board thickness:0.25-6 mm
Number of layer:1-18 layer
Copper thickness:0.5-5oz
Surface finish:HASL,OSP,ENIG,Immersion silver
Test: E-test