WE CAN DO :
| Description | Technology Ability | |
| Max. Layers | 35L | |
| LW/LS | Inner Layer | 75/75um |
| Outer Layer | 75/75um | |
| Min. Mechanical Drilling | 50um | |
| Aspect Ratio | 15:1 | |
| Copper Thickness | 8 oz | |
| Impedance Control | +/-5% | |
| Material | High Frequency/Microwave | Volume |
| Halogen-Free | Volume | |
| Lead Free | Volume | |
| Mix-material | Volume | |
| Metal Based/Core | Volume | |
| High Tg | Volume | |
| HDI | 1+C+1 | Volume |
| Rigid-Flex | 14 layers | Volume |
| Buried Resistor / Capacitor | Volume | |
| Surface Technique | OSP, Immersion gold, Selective gold plating, Immersion Tin, Immersion silver, HAL Lead Free | |
| SMT/PCBA | Size : 50*50~510*460mm, PCB thickness 0.4~3mm, Min. SMD Package : 0201 | |
| PCB Layout Design | High-speed Multilayers PCB Layout Desigh for Network, Telecommunication, etc. | |