- Good Quality with competitive price;
- Door to Door Delivery service;
- Vacuum Seal package & fast lead time.
|
NO
|
Item
|
Craft Capacity
|
|
1
|
Layer
|
1-30 Layers
|
|
2
|
Base Material for PCB
|
FR4, CEM-1, TACONIC, Aluminium, High Tg MaterialHigh FrequenceROGERS ,TEFLON, ARLON, Halogen-free Material
|
|
3
|
Rang of finish baords Thickness
|
0.15-7.0mm
|
|
4
|
Max size of finish board
|
900MM*900MM
|
|
5
|
Minimum Linewidth
|
3mil (0.075mm)
|
|
6
|
Minimum Line space
|
3mil (0.075mm)
|
|
7
|
Min space between pad to pad
|
3mil (0.075mm)
|
|
8
|
Minimum hole diameter
|
0.10 mm
|
|
9
|
Min bonding pad diameter
|
10mil
|
|
10
|
Max proportion of drilling hole and board thickness
|
1:12.5
|
|
11
|
Minimum linewidth of Idents
|
4mil
|
|
12
|
Min Height of Idents
|
25mil
|
|
13
|
Finishing Treatment
|
HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
|
|
14
|
Soldermask
|
Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
|
|
15
|
Minimun thickness of soldermask
|
10um
|
|
16
|
Color of silk-screen
|
White, Black, Yellow ect.
|
|
17
|
E-Testing
|
100% E-Testing (High Voltage Testing); Flying Probe Testing
|
|
18
|
Other test
|
ImpedanceTesting,Resistance Testing, Microsection etc.,
|
|
19
|
Date file format
|
GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
|
|
20
|
Special technological requirement
|
Blind & Buried Vias and High Thickness copper
|
| 21 | Thickness of Copper | 0.5-14oz (18-490um) |