Features & Applications of Silicone for LED encapsulation

Silicone for LED encapsulation is condensation silicone potting compound in two parts with low viscosity.

It can be cured completely at room temperature. It works on the surface of material as PC(Poly-carbonate), PP, ABS, PVC as to its superior bonding feature.  It is also applicable for insulation, waterproof and bonding of electronics parts. It meets the requirements of European RoHS.

 

Typical Application of Silicone for LED encapsulation

- Potting for Protetion of general electronic Module.  

- Outdoor protection for LED screen. 

 

 

TECHNICAL GUIDELINES of Silicone for LED encapsulation

1, Pls put part A and part B in separate container and stir evenly before mixing the two parts together.

2, Weight Ratio: part A: part B = 10:1 or 1:1

3, Bubble release if necessary. Desecration the mixture under 0.08 MPa for 3 minutes.

4, HY 210 is cured at room temperature, so pls put it under room temperature after pouring. It comes to next process when basically cured, and it takes about 24 hours for completely cured.

Kindly note:  Temperature and Humidity with tremendous influences for curing of HY 210.

 

Warm Tips of Silicone for LED encapsulation:

1. Sealing package for storage. The mixture should be used up at once to avoid wasting.

2. Silicone belongs to non-dangerous goods, but keeps away from mouth and eyes.

3. When it gets stratified after a period of storage, please mix it evenly before using, it does not affect the performance.