1.Multilayer Telecommunication pcb manufacturer
2.PCB assembly Prototype and MP
3. 100% E-TEST and X-ray Before shipment ,99.9% qualified after test for all multilayer PCBs.
2.PCB assembly Prototype and MP
3. 100% E-TEST and X-ray Before shipment ,99.9% qualified after test for all multilayer PCBs.
4. Competitive price and high quality PCB board and PCB assembly
5. China 3 factories 18 years PCB manufacturer and assembly PCBA.
6. BGA planting and SMD/DIP assembly, 6SMT lines and 35 engineers.
7. Components sourcing all from manufacturer like TI, Atmel, Philip, Analog, ST, Microchip, Murata, Epcos,
Nichicon, Vishay, Yagoe, Bonus . 100% qualified and trustful ,all original and new according to Customers' BOM.
8. Welcome Customers to visit us and coach our work
Layer: 10 Layer
Vias: Buried and blind Vias
Material: FR4 TG170
Thickness: 1.6mm
Copper thickness: 35um
Mini Hole: 0.1mm
Mini Width/space: 0.15mm/0.2mm
Testing points: 4000
Solder Mask: LPI Green
Sickscreen: White
Function:Telecommunication PCBA
Finish: Immersion Tin
1.PCB Manufacture Capability
|
Item
|
Capability
|
|
|
1.Base Material
|
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC
|
|
|
2.Layers
|
1-28
|
|
|
3.Finised inner/outer copper thickness
|
1-6OZ
|
|
|
4.Finished board thickness
|
0.2-7.0mm
|
|
|
Tolerance
|
Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
|
|
|
5.Max panel size
|
≤2sidesPCB: 600*1500mm
Multilayer PCB: 500*1200mm
|
|
|
6.Min conductor line width/spacing
|
Inner layers: ≥3/3mil
Outer layers: ≥3.5/3.5mil
|
|
|
7.Min hole size
|
Mechanical hole: 0.15mm
Laser hole: 0.1mm
|
|
|
Drilling precision: first drilling
|
First drilling: 1mil
Second drilling: 4mil
|
|
|
8.Warpage
|
Board thickness≤0.79mm: β≤1.0%
0.80≤Board thickness≤2.4mm: β≤0.7%
Board thickness≥2.5mm: β≤0.5%
|
|
|
9.Controlled Impedance
|
+/-10%
|
|
|
10. Aspect Ratio
|
15:1
|
|
|
11.Min welding ring
|
4mil
|
|
|
12.Min solder mask bridge
|
≥0.08mm
|
|
|
13.Plugging vias capability
|
0.2-0.8mm
|
|
|
14. Hole tolerance
|
PTH: +/-3mil
NPTH: +/-2mil
|
|
|
15.Outline profile
|
Rout/ V-cut/ Bridge/ Stamp hole
|
|
|
16.Surface treatment
|
OSP: 0.5-0.5um
HASL: 2-40um
Lead free HASL: 2-40um
ENIG: Au 1-10U’’
ENEPIG: PB 2-5U’’/ Au 1-8U’’
Immersion Tin:0.8-1.2um
Immersion silver: 0.1-1.2um
Peelable blue mask
Carbon ink
Gold plating: Au 1-150U’’
|
|
|
17. E-testing pass percent
|
97% pass for the first time,+/-2%(tolerance)
|
|
|
FQC-Physical Lab: Reliability tests
|
||
|
18.Certificate
|
ROHS UL:E327776 ISO9001:2008 IPC SGS
|
|
|
|
||
|
Our equipments
|
||
|
1.Drilling workshop
|
4 drilling bits of drilling machine: 4 sets
2 drilling bits of drilling machine: 2 sets
|
|
|
2. photo plotting workshop
|
Israel “ORBOTECH” Photo Plotters
|
|
|
3.AOI
|
AOI machine
|
|
|
4.IPQC
|
“OXFORD” CMI 700 Copper Thickness Tester
|
|
|
5.Impedance test
|
USA “Tektronix” DSA 8200 Impedance Tester
|
|
|
6.Outline workshop
|
CNC routing machine: 7 sets
angle-cutting machine
V-cut machine
|
|
|
7.Testing Workshop
|
Surpass X-600: 2sets
WTD FT-2808: 5sets
WTD HV300: 1set
|
|
|
8.X-ray
|
X-ray machine
|
|
|
|
||
|
Acceptable file format
|
||
|
GERBER file, PROTEL series, PADS series, POWER PCB series, AutoCAD series.
|
||
|
|
||