Base material: aluminum
Copper thicknesses: 0.5 to 1.0oz
Board thicknesses: 0.6 to 3.0mm
Hole diameter: 0.6mm (minimum)
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round
Base material: aluminum
Copper thicknesses: 0.5 to 1.0oz
Board thicknesses: 0.6 to 3.0mm
Hole diameter: 0.6mm (minimum)
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round
Copper thicknesses: 0.5 to 1.0oz
Board thicknesses: 0.6 to 3.0mm
Hole diameter: 0.6mm (minimum)
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round
Base material: aluminum
Copper thicknesses: 0.5 to 1.0oz
Board thicknesses: 0.6 to 3.0mm
Hole diameter: 0.6mm (minimum)
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round