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Specifications

Base material: aluminum 
Copper thicknesses: 0.5 to 1.0oz 
Board thicknesses: 0.6 to 3.0mm 
Hole diameter: 0.6mm (minimum) 
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round 

Base material: aluminum 
Copper thicknesses: 0.5 to 1.0oz 
Board thicknesses: 0.6 to 3.0mm 
Hole diameter: 0.6mm (minimum) 
Line width: 0.12mm (minimum)
Line spacing: 0.12mm
Surface finish: OSP
Immersion Ag/silver, HAL
Shape: round