Base material: FR4 
Copper thickness: 70nm 
Board thickness: 1.5mm 
Minimum hole size: 0.4mm 
Minimum line width: 11 mils 
Minimum line spacing: 9 mils 
Surface finishing: immersion gold 
Warp and twist: 0.70%
Insulation resistance: 10k x 937 to 20m x 937
Conductivity: <50 x 937
Test voltage: 10 to 300V 
Base material: FR4 
Copper thickness: 70nm 
Board thickness: 1.5mm 
Minimum hole size: 0.4mm 
Minimum line width: 11 mils 
Minimum line spacing: 9 mils 
Surface finishing: immersion gold 
Warp and twist: 0.70%
Insulation resistance: 10k x 937 to 20m x 937
Conductivity: <50 x 937
Test voltage: 10 to 300V