Base materials: FR-4, CEM-1 and more
Copper thickness: according to your requirements
Board thickness: 0.2, 0.4, 0.6, 0.8 and 1.1mm
Hole diameter: 0.1mm (minimum)
Line width: 2 mils (minimum)
Line spacing: 2 mils (minimum)
Surface finishing: immersion tin, HASL lead-free
Color: white
Dimension: 500 x 600/500 x 1,000/600 x 1,000mm
Coefficient of thermal conductivity: 1.0W/m
Base materials: FR-4, CEM-1 and more
Copper thickness: according to your requirements
Board thickness: 0.2, 0.4, 0.6, 0.8 and 1.1mm
Hole diameter: 0.1mm (minimum)
Line width: 2 mils (minimum)
Line spacing: 2 mils (minimum)
Surface finishing: immersion tin, HASL lead-free
Color: white
Dimension: 500 x 600/500 x 1,000/600 x 1,000mm
Coefficient of thermal conductivity: 1.0W/m
Copper thickness: according to your requirements
Board thickness: 0.2, 0.4, 0.6, 0.8 and 1.1mm
Hole diameter: 0.1mm (minimum)
Line width: 2 mils (minimum)
Line spacing: 2 mils (minimum)
Surface finishing: immersion tin, HASL lead-free
Color: white
Dimension: 500 x 600/500 x 1,000/600 x 1,000mm
Coefficient of thermal conductivity: 1.0W/m
Base materials: FR-4, CEM-1 and more
Copper thickness: according to your requirements
Board thickness: 0.2, 0.4, 0.6, 0.8 and 1.1mm
Hole diameter: 0.1mm (minimum)
Line width: 2 mils (minimum)
Line spacing: 2 mils (minimum)
Surface finishing: immersion tin, HASL lead-free
Color: white
Dimension: 500 x 600/500 x 1,000/600 x 1,000mm
Coefficient of thermal conductivity: 1.0W/m