Instruction of Additional type heat conduction liquid potting compound silicone :

HY9055# is two-part, additional type, heat conduction silicone potting compound with RoSH standard. It can be cured in room temperature and by heat, higher temperature will make it cure faster. It has excellent electric properties, inflaming retarding UL94 V-0, no corrosion and long pot life. It suits for metal surfaces, PC, PP, ABS and PVC materials. It is widely used for high power electronic components, transformers and rectification circuits.

 

 

Technical Parameters

Before Curing	Appearence	Black Fluid
	Density(25° C g/ml)	0.98± 0.02
	Viscosisty(25° Ccps)	Part A 2500± 500; Part B:2500± 500
	Mixing Ratio	A: B=1:1(By weight)
	Operating Time(25° C min)	120
	Curing time(25° C min)	480
	Curing time(80° C min)	20
After Curing	Hardness(Shore A)	50-60
	Dielectric Strength(KV/mm)	23
	Volume Resistance(Ω. Cm)	1.0× 10 15
	Permittivity(1.2MHz)	3.0
	Temperature Resistence(° C)	-60~200
	Fire Resistance	UL94-V1
	Arc Resistance	250V

 

 

 

Usage of Additional type heat conduction liquid potting compound silicone :

(1) Stir A, B parts well respectively, then mix A and B well according A: B=1:1.

(2) Encapsulation after mixed well (suggest to the vacuum debubbling).

(3) If the poured components are tinny and multiple-slot, continuous pouring to be advised.

(4) If pouring depth is more than 6mm, curing time will be longer.

 

 

Notice of Additional type heat conduction liquid potting compound silicone :

(1) B part should be seal preservation.

(2) Curing time can be adjusted by B part. More B part, higher curing speed.

(3) Avoid closed environment and high ambient temperature more than 60° C when curing.

 

Storage of Additional type heat conduction liquid potting compound silicone :

Storage: in a cool and dry place.

PACKING

20Kg/drum