Product Description
Dimensions: 99.90 99.95 99.99 
Chemical Composition: Tin Alloy Or Not: Non-alloy 
Weight: 25KG +/-0.2KG 
Secondary Or Not: Non-secondary 
Sn (Min): 99.90%

 

Product Feature
.High purity(Sn99.99 Sn99.95 Sn99.90), excellent weldability, good infiltration. 
2.Clean, beautiful.After welding, insulation, high resistance, low ionic contamination, PCB board welding residual minimal.
3.Good oxidation resistance, low tin slag and cost savings. 
4.Solder joint is bright, full and uniform. 
5.Economical and can produce the lowest consumption of the solid solder joints
 

Product Specification/Models
COMMODITY:TIN INGOT 99.9% 
STANDARD:BS EN 610-1996(GRADE DESIGNATION 99.90) 
MARK:SN99.90

Purity(%)	As	Fe	Cu	Pb	Bi	Sb	Cd	Zn	Al	Total
99.99	0.0005	0.0025	0.0005	0.0035	0.0025	0.002	0.0003	0.0005	0.0005	0.01
99.95	0.003	0.004	0.004	0.01	0.006	0.014	0.0005	0.0008	0.0008	0.05
99.90	0.008	0.0025	0.008	0.04	0.015	0.02	0.0008	0.001	0.001	0.1

Detailed Product Description

Application
1.Mainly used for electronic industry soldering

2. In the float glass production , molten glass floating on molten tin pool surface is easily to be cooled and solidified.

3. Widely used as a coating material in High-precision electronic products, and other requirements of precision welding products, welding products, general electronics, food industry packaging, automotive and electrical industry, and high temperature resistant products