NO	ITEM	Technical capabilities
1	Layers	1- 20 layers
2	Max Board Size	610x610mm
3	Min Board Thickness	2 layers - 8mil (0.2mm)
4		4 layers - 16mil (0.4mm)
5		6 layers - 24mil (0.6mm)
6		8 layers - 32mil (0.8mm)
7		10 layers - 40mil (1.0mm)
8	Max Board Thickness	280mil (7mm)
9	Min Line Width	3 mil (0.075mm)
10	Min Line Space	3 mil (0.075mm)
11	Min Hole Size	6 mil (0.15mm)
12	PTH dia tolerance	+/- 2mil (0.05mm)
13	NPTH hole dia tolerance	﹢/﹣1mil (0.025mm)
14	Hole Position Deviation	﹢/-2mil (0.05mm)
15	Outline Tolerance	+/- 4mil (0.1mm)
16	S/M Pitch	3mil (0.075mm)
17	Aspect ratio (AR)	1;12
18	Finished Copper Thickness	7 oz
19	Profiling	Punching, Routing, V-CUT, Beveling
20	Impedance Control	+/- 5%
21	Insulation Resistance	1E+12Ω(Normal)
22	Thermal Shock	3*288Sec
23	Warp and Twist	<= 0.7%
24	Electric Strength	> 1.3KV/mm
25	Peel Strength	1.4N/mm
26	Solder Mask Color	Green/Yellow/Black/White/Red/Blue
27	Solder Mask Abrasion	>= 6H
28	Flammability	94V-0
29	Surface Finishing	HASL, LF-HASL, ENIG, Flash Gold, Immersion Tin, Immersion Silver, OSP,Gold Finger, Peelable Mask, Carbon Printing. and selective surface processing
31	Material	FR-4, ROGERS, Taconic, ARLON, BT, Ceramic, Aluminum
32	PCB Packing	Inner packing: Vacuum packing / Plastic bag
33		Outer packing: Standard carton packing
34	Certificate	UL-351742, ISO 9001,  SGS.DQS
35	Target Market(s)	Eastern Europe,  Hong Kong/ Macao/ Taiwan,  Japan & Korea,  Latin America,  Mainland China,  North America,  Northern Europe,  Oceania,  Southeast Asia,  Western Europe
36	Payment Terms	T/T,  L/C
37	Minimum Order	20sqm
38	Lead Time Delivery Time	15 days
39	Sample Available	YES
40	FOB Port	Shenzhen
41	Loading Info	Depend on customer
42	Packing Info	Standard carton with min cardboard on six sides to protect the goods.