• Specifications:
  • Base material: FR4 TG150
  • Board thickness: 1.6mm
  • Layers: 2
  • Minimum drilling hole: 0.2mm
  • Finish copper thickness: 1oz
  • Surface finish: ENIG
  • Application: automotive electronics
• Craft ability table:
  • Minimum line width/spacing: 0.075/0.075mm
  • Minimum solder mask dam: 3.5-mil
  • Minimum and maximum board thickness: 0.1 to 3.2mm
  • Maximum finishing copper thickness: 10oz
  • Maximum board size: 546 x 1,200mm
  • Maximum layers count: 22
  • Impedance control: ±8%