Product Main

Specifications

Key Specifications/Special Features:
  • Base material: FR4 TG150
  • Board thickness: 1.6mm
  • Layer: 2
  • Minimum line width/spacing: 1.5mm/1.5mm
  • Minimum drilling hole: 0.3
  • Finish copper thickness: 1oz
  • Surface finish: ENIG
  • Specialty: COB PCB
  • Applications: LCD
  • Craft ability table:
    • Minimum line width/spacing: 0.075/0.075mm
    • Minimum solder mask dam: 0.075
    • Minimum and maximum board thickness: 0.1 to 3.2mm
    • Maximum finishing copper thickness: 10oz
    • Maximum board size: 546 x 1,200mm
    • Maximum layers count: 22
    • Impedance control: ±8%